Qualcomm SA522M platform, 3GPP Rel-16, multi-region certified for global automotive deployment
The Quectel AG59xE series is a premium automotive-grade 5G module built on the Qualcomm® SA522M chipset (AEC-Q100 certified). It delivers 5G NR Sub-6GHz connectivity with SA/NSA dual-mode, supporting downlink speeds up to 4.4 Gbps and uplink up to 900 Mbps. The module integrates optional C-V2X PC5 Mode 4 direct communication for V2V/V2I/V2P scenarios, along with a high-precision multi-constellation GNSS engine with RTK and QDR 3.0 dead-reckoning.
Available in CN, EU, NA, and ROW regional variants, the AG59xE is pin-to-pin compatible with the AG55xQ/AG57xQ series, enabling seamless migration paths for OEM designs. The module operates across -40°C to +85°C (extendable to +105°C) and conforms to IATF 16949 quality standards with APQP/PPAP process compliance. Data source: Quectel official product documentation (2025).
3GPP Release 16 compliant, SA/NSA dual-mode, 4×4 MIMO, DL up to 4.4 Gbps / UL 900 Mbps (5G NSA). Backward compatible with LTE-A, 4G/3G/2G.
Optional Mode 4 sidelink communication on ITS 5.9 GHz band with integrated ECDSA engine for real-time V2X signature verification.
AEC-Q100 qualified chipset with integrated application processor up to 20K DMIPS, enabling on-module edge computing.
GPS/GLONASS/BDS/Galileo/QZSS support with dual-frequency L1+L5/L2, RTK positioning, and QDR 3.0 dead-reckoning for lane-level accuracy.
Rated -40°C to +85°C standard operation; eCall variant supports +95°C, expandable to +105°C for engine bay proximity installations.
Drop-in replacement for AG55xQ and AG57xQ series, enabling OEMs to upgrade from LTE to 5G without PCB redesign.
Dedicated SKUs for China (CN), Europe (EU), North America (NA), and Rest-of-World (ROW) ensuring optimal band coverage globally.
IATF 16949 certified manufacturing, AEC-Q100 chip qualification, full APQP/PPAP process compliance for automotive supply chain.
| Parameter | Specification |
|---|---|
| Product Model | AG590E / AG591E (AG59xE series) |
| Brand | Quectel (Shanghai Quectel Communication Solutions) |
| Chipset Platform | Qualcomm SA522M (AEC-Q100) |
| 5G Standard | 3GPP Release 16, NR Sub-6GHz, SA/NSA |
| Max DL Speed (5G) | 4.4 Gbps (NSA) |
| Max UL Speed (5G) | 900 Mbps (NSA) |
| LTE-A DL / UL | 1.2 Gbps / 200 Mbps |
| MIMO Configuration | 4×4 MIMO |
| C-V2X | PC5 Mode 4, ITS 5.9 GHz (optional) |
| ECDSA Engine | Hardware-accelerated C-V2X signature verification |
| GNSS | GPS/GLONASS/BDS/Galileo/QZSS, L1+L5/L2 dual-freq |
| RTK / Dead Reckoning | RTK positioning, QDR 3.0 |
| Application Processor | Up to 20K DMIPS |
| Interfaces | PCIe 3.0, USB 2.0/3.1, SDIO, I2S, SPI, I2C, UART, PCM, ADC, (U)SIM, 1PPS, GPIO, RGMII/SGMII |
| Operating Temperature | -40°C to +85°C (+95°C eCall, +105°C extended) |
| Package | LGA |
| Pin Compatibility | AG55xQ / AG57xQ series |
| Regional Variants | AG59xE-CN / -EU / -NA / -ROW |
| Quality Certification | IATF 16949, AEC-Q100 (chip-level) |
| Process Compliance | APQP / PPAP |
| Data Source | Quectel official product documentation (2025) |
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